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Processing-using-DRAM (PuD) is a promising paradigm for alleviating the data movement bottleneck using DRAM's massive internal parallelism and bandwidth to execute very wide operations. Performing a PuD operation involves activating multiple DRAM rows in quick succession or simultaneously, i.e., multiple-row activation. Multiple-row activation is fundamentally different from conventional memory access patterns that activate one DRAM row at a time. However, repeatedly activating even one DRAM row (e.g., RowHammer) can induce bitflips in unaccessed DRAM rows because modern DRAM is subject to read disturbance. Unfortunately, no prior work investigates the effects of multiple-row activation on DRAM read disturbance. In this paper, we present the first characterization study of read disturbance effects of multiple-row activation-based PuD (which we call PuDHammer) using 316 real DDR4 DRAM chips from four major DRAM manufacturers. Our detailed characterization show that 1) PuDHammer significantly exacerbates the read disturbance vulnerability, causing up to 158.58x reduction in the minimum hammer count required to induce the first bitflip ($HC_{first}$), compared to RowHammer, 2) PuDHamm

To understand and improve DRAM performance, reliability, security and energy efficiency, prior works study characteristics of commodity DRAM chips. Unfortunately, state-of-the-art open source infrastructures capable of conducting such studies are obsolete, poorly supported, or difficult to use, or their inflexibility limit the types of studies they can conduct. We propose DRAM Bender, a new FPGA-based infrastructure that enables experimental studies on state-of-the-art DRAM chips. DRAM Bender offers three key features at the same time. First, DRAM Bender enables directly interfacing with a DRAM chip through its low-level interface. This allows users to issue DRAM commands in arbitrary order and with finer-grained time intervals compared to other open source infrastructures. Second, DRAM Bender exposes easy-to-use C++ and Python programming interfaces, allowing users to quickly and easily develop different types of DRAM experiments. Third, DRAM Bender is easily extensible. The modular design of DRAM Bender allows extending it to (i) support existing and emerging DRAM interfaces, and (ii) run on new commercial or custom FPGA boards with little effort. To demonstrate that DRAM Bender

Increasing storage density exacerbates DRAM read disturbance, a circuit-level vulnerability exploited by system-level attacks. Unfortunately, existing defenses are either ineffective or prohibitively expensive. Efficient mitigation is critical to ensure robust (reliable, secure, and safe) execution in future DRAM-based systems. This dissertation tackles two problems: 1) protecting DRAM-based systems becomes more expensive as technology scaling increases read disturbance vulnerability, and 2) many existing solutions depend on proprietary knowledge of DRAM internals. First, we build a detailed understanding of DRAM read disturbance by rigorously characterizing off-the-shelf modern DRAM chips under varying 1) temperatures, 2) memory access patterns, 3) in-chip locations, and 4) voltage. Our novel observations demystify the implications of large DRAM read disturbance variation on future DRAM read disturbance attacks and solutions. Second, we propose new mechanisms that mitigate read disturbance bitflips efficiently and scalably by leveraging insights into DRAM chip design: 1) subarray-level parallelism and 2) variation in read disturbance across DRAM rows in off-the-shelf DRAM chips. T

We propose overcoming the memory capacity limitation of GPUs with high-capacity Storage-Class Memory (SCM) and DRAM cache. By significantly increasing the memory capacity with SCM, the GPU can capture a larger fraction of the memory footprint than HBM for workloads that oversubscribe memory, achieving high speedups. However, the DRAM cache needs to be carefully designed to address the latency and BW limitations of the SCM while minimizing cost overhead and considering GPU's characteristics. Because the massive number of GPU threads can thrash the DRAM cache, we first propose an SCM-aware DRAM cache bypass policy for GPUs that considers the multi-dimensional characteristics of memory accesses by GPUs with SCM to bypass DRAM for data with low performance utility. In addition, to reduce DRAM cache probes and increase effective DRAM BW with minimal cost, we propose a Configurable Tag Cache (CTC) that repurposes part of the L2 cache to cache DRAM cacheline tags. The L2 capacity used for the CTC can be adjusted by users for adaptability. Furthermore, to minimize DRAM cache probe traffic from CTC misses, our Aggregated Metadata-In-Last-column (AMIL) DRAM cache organization co-locates all

We propose Sectored DRAM, a new, low-overhead DRAM substrate that reduces wasted energy by enabling fine-grained DRAM data transfers and DRAM row activation. Sectored DRAM leverages two key ideas to enable fine-grained data transfers and row activation at low chip area cost. First, a cache block transfer between main memory and the memory controller happens in a fixed number of clock cycles where only a small portion of the cache block (a word) is transferred in each cycle. Sectored DRAM augments the memory controller and the DRAM chip to execute cache block transfers in a variable number of clock cycles based on the workload access pattern with minor modifications to the memory controller's and the DRAM chip's circuitry. Second, a large DRAM row, by design, is already partitioned into smaller independent physically isolated regions. Sectored DRAM provides the memory controller with the ability to activate each such region based on the workload access pattern via small modifications to the DRAM chip's array access circuitry. Activating smaller regions of a large row relaxes DRAM power delivery constraints and allows the memory controller to schedule DRAM accesses faster. Compared t

DRAM is the prevalent main memory technology, but its long access latency can limit the performance of many workloads. Although prior works provide DRAM designs that reduce DRAM access latency, their reduced storage capacities hinder the performance of workloads that need large memory capacity. Because the capacity-latency trade-off is fixed at design time, previous works cannot achieve maximum performance under very different and dynamic workload demands. This paper proposes Capacity-Latency-Reconfigurable DRAM (CLR-DRAM), a new DRAM architecture that enables dynamic capacity-latency trade-off at low cost. CLR-DRAM allows dynamic reconfiguration of any DRAM row to switch between two operating modes: 1) max-capacity mode, where every DRAM cell operates individually to achieve approximately the same storage density as a density-optimized commodity DRAM chip and 2) high-performance mode, where two adjacent DRAM cells in a DRAM row and their sense amplifiers are coupled to operate as a single low-latency logical cell driven by a single logical sense amplifier. We implement CLR-DRAM by adding isolation transistors in each DRAM subarray. Our evaluations show that CLR-DRAM can improve sy

We experimentally demonstrate that it is possible to generate unique, repeatable, and device-specific signatures suitable for use as Physical Unclonable Function (PUF) responses in commercial off-the-shelf (COTS) DRAM chips by leveraging simultaneous multiple-row activation (SiMRA). Based on a rigorous experimental characterization of 112 modern DDR4 DRAM chips (from 10 modules), we introduce SiMRA-PUF, the first DRAM-based PUF that uses SiMRA-generated signatures as PUF responses. We analyze SiMRA-PUF in terms of reliability, uniqueness, and evaluation latency for varying numbers of simultaneously activated DRAM rows (i.e., 2, 4, 8, 16, and 32), DRAM chip density & die revision, and evaluate how temperature affects the similarity of SiMRA-generated responses. Among our 8 key experimental observations, we highlight two major results. First, SiMRA-PUF provides average intra-Jaccard indices of 89.02%, 89.81%, 93.03%, 94.06%, and 94.86%, and average inter-Jaccard indices of 3.98%, 2.37%, 3.44%, 2.92%, and 3.24% for 2-, 4-, 8-, 16-, and 32-row activations, respectively, showing that SiMRA-generated signatures are both repeatable within a device and unique across devices. Second, 2-

Generational improvements to commodity DRAM throughout half a century have long solidified its prevalence as main memory across the computing industry. However, overcoming today's DRAM technology scaling challenges requires new solutions driven by both DRAM producers and consumers. In this paper, we observe that the separation of concerns between producers and consumers specified by industry-wide DRAM standards is becoming a liability to progress in addressing scaling-related concerns. To understand the problem, we study four key directions for overcoming DRAM scaling challenges using system-memory cooperation: (i) improving memory access latencies; (ii) reducing DRAM refresh overheads; (iii) securely defending against the RowHammer vulnerability; and (iv) addressing worsening memory errors. We find that the single most important barrier to advancement in all four cases is the consumer's lack of insight into DRAM reliability. Based on an analysis of DRAM reliability testing, we recommend revising the separation of concerns to incorporate limited information transparency between producers and consumers. Finally, we propose adopting this revision in a two-step plan, starting with imm

DRAM read disturbance can break memory isolation, a fundamental property to ensure system robustness (i.e., reliability, security, safety). RowHammer and RowPress are two different DRAM read disturbance phenomena. RowHammer induces bitflips in physically adjacent victim DRAM rows by repeatedly opening and closing an aggressor DRAM row, while RowPress induces bitflips by keeping an aggressor DRAM row open for a long period of time. In this study, we characterize a DRAM access pattern that combines RowHammer and RowPress in 84 real DDR4 DRAM chips from all three major DRAM manufacturers. Our key results show that 1) this combined RowHammer and RowPress pattern takes significantly smaller amount of time (up to 46.1% faster) to induce the first bitflip compared to the state-of-the-art RowPress pattern, and 2) at the minimum aggressor row activation count to induce at least one bitflip, the bits that flip are different across RowHammer, RowPress, and the combined patterns. Based on our results, we provide a key hypothesis that the read disturbance effect caused by RowPress from one of the two aggressor rows in a double-sided pattern is much more significant than the other.

Processing-in-Memory (PIM) architectures enable computation directly within DRAM and help combat the memory wall problem. Bit-shifting is a fundamental operation that enables PIM applications such as shift-and-add multiplication, adders using carry propagation, and Galois field arithmetic used in cryptography algorithms like AES and Reed-Solomon error correction codes. Existing approaches to in-DRAM shifting require adding dedicated shifter circuits beneath the sense amplifiers to enable horizontal data movement across adjacent bitlines or vertical data layouts which store operand bits along a bitline to implement shifts as row-copy operations. In this paper, we propose a novel DRAM subarray design that enables in-DRAM bit-shifting for open-bitline architectures. In this new design, we built upon prior work that introduced a new type of cell used for row migration in asymmetric subarrays, called a "migration cell". We repurpose and extend the functionality by adding a row of migration cells at the top and bottom of each subarray which enables bidirectional bit-shifting within any given row. This new design maintains compatibility with standard DRAM operations. Unlike previous appro

The memory controller is in charge of managing DRAM maintenance operations (e.g., refresh, RowHammer protection, memory scrubbing) to reliably operate modern DRAM chips. Implementing new maintenance operations often necessitates modifications in the DRAM interface, memory controller, and potentially other system components. Such modifications are only possible with a new DRAM standard, which takes a long time to develop, likely leading to slow progress in the adoption of new architectural techniques in DRAM chips. We propose a new low-cost DRAM architecture, Self-Managing DRAM (SMD), that enables autonomous in-DRAM maintenance operations by transferring the responsibility for controlling maintenance operations from the memory controller to the SMD chip. To enable autonomous maintenance operations, we make a single modification to the DRAM interface, such that an SMD chip rejects memory controller accesses to DRAM regions under maintenance, while allowing memory accesses to others. Thus, SMD enables 1) implementing new in-DRAM maintenance mechanisms (or modifying existing ones) with no further changes in the DRAM interface or other system components, and 2) overlapping the latency o

Dynamic Random Access Memory (DRAM) is the prevalent memory technology used to build main memory systems of almost all computers. A fundamental shortcoming of DRAM is the need to refresh memory cells to keep stored data intact. DRAM refresh consumes energy and degrades performance. It is also a technology scaling challenge as its negative effects become worse as DRAM cell size reduces and DRAM chip capacity increases. Our ISCA 2012 paper, RAIDR, examines the DRAM refresh problem from a modern computing systems perspective, demonstrating its projected impact on systems with higher-capacity DRAM chips expected to be manufactured in the future. It proposes and evaluates a simple and low-cost solution that greatly reduces the performance & energy overheads of refresh by exploiting variation in data retention times across DRAM rows. The key idea is to group the DRAM rows into bins in terms of their minimum data retention times, store the bins in low-cost Bloom filters, and refresh rows in different bins at different rates. Evaluations in our paper (and later works) show that the idea greatly improves performance & energy efficiency and its benefits increase with DRAM chip capaci

Memory isolation is critical for system reliability, security, and safety. Unfortunately, read disturbance can break memory isolation in modern DRAM chips. For example, RowHammer is a well-studied read-disturb phenomenon where repeatedly opening and closing (i.e., hammering) a DRAM row many times causes bitflips in physically nearby rows. This paper experimentally demonstrates and analyzes another widespread read-disturb phenomenon, RowPress, in real DDR4 DRAM chips. RowPress breaks memory isolation by keeping a DRAM row open for a long period of time, which disturbs physically nearby rows enough to cause bitflips. We show that RowPress amplifies DRAM's vulnerability to read-disturb attacks by significantly reducing the number of row activations needed to induce a bitflip by one to two orders of magnitude under realistic conditions. In extreme cases, RowPress induces bitflips in a DRAM row when an adjacent row is activated only once. Our detailed characterization of 164 real DDR4 DRAM chips shows that RowPress 1) affects chips from all three major DRAM manufacturers, 2) gets worse as DRAM technology scales down to smaller node sizes, and 3) affects a different set of DRAM cells fro

DRAM is the dominant main memory technology used in modern computing systems. Computing systems implement a memory controller that interfaces with DRAM via DRAM commands. DRAM executes the given commands using internal components (e.g., access transistors, sense amplifiers) that are orchestrated by DRAM internal timings, which are fixed foreach DRAM command. Unfortunately, the use of fixed internal timings limits the types of operations that DRAM can perform and hinders the implementation of new functionalities and custom mechanisms that improve DRAM reliability, performance and energy. To overcome these limitations, we propose enabling programmable DRAM internal timings for controlling in-DRAM components. To this end, we design CODIC, a new low-cost DRAM substrate that enables fine-grained control over four previously fixed internal DRAM timings that are key to many DRAM operations. We implement CODIC with only minimal changes to the DRAM chip and the DDRx interface. To demonstrate the potential of CODIC, we propose two new CODIC-based security mechanisms that outperform state-of-the-art mechanisms in several ways: (1) a new DRAM Physical Unclonable Function (PUF) that is more rob

In modern systems, DRAM-based main memory is significantly slower than the processor. Consequently, processors spend a long time waiting to access data from main memory, making the long main memory access latency one of the most critical bottlenecks to achieving high system performance. Unfortunately, the latency of DRAM has remained almost constant in the past decade. This is mainly because DRAM has been optimized for cost-per-bit, rather than access latency. As a result, DRAM latency is not reducing with technology scaling, and continues to be an important performance bottleneck in modern and future systems. This dissertation seeks to achieve low latency DRAM-based memory systems at low cost in three major directions. First, based on the observation that long bitlines in DRAM are one of the dominant sources of DRAM latency, we propose a new DRAM architecture, Tiered-Latency DRAM (TL-DRAM), which divides the long bitline into two shorter segments using an isolation transistor, allowing one segment to be accessed with reduced latency. Second, we propose a fine-grained DRAM latency reduction mechanism, Adaptive-Latency DRAM, which optimizes DRAM latency for the common operating cond

This paper summarizes the idea of Tiered-Latency DRAM (TL-DRAM), which was published in HPCA 2013, and examines the work's significance and future potential. The capacity and cost-per-bit of DRAM have historically scaled to satisfy the needs of increasingly large and complex computer systems. However, DRAM latency has remained almost constant, making memory latency the performance bottleneck in today's systems. We observe that the high access latency is not intrinsic to DRAM, but a trade-off is made to decrease the cost per bit. To mitigate the high area overhead of DRAM sensing structures, commodity DRAMs connect many DRAM cells to each sense amplifier through a wire called a bitline. These bit-lines have a high parasitic capacitance due to their long length, and this bitline capacitance is the dominant source of DRAM latency. Specialized low-latency DRAMs use shorter bitlines with fewer cells, but have a higher cost-per-bit due to greater sense amplifier area overhead. To achieve both low latency and low cost per bit, we introduce Tiered-Latency DRAM (TL-DRAM). In TL-DRAM, each long bitline is split into two shorter segments by an isolation transistor, allowing one of the two seg

Processing-using-DRAM has been proposed for a limited set of basic operations (i.e., logic operations, addition). However, in order to enable the full adoption of processing-using-DRAM, it is necessary to provide support for more complex operations. In this paper, we propose SIMDRAM, a flexible general-purpose processing-using-DRAM framework that enables massively-parallel computation of a wide range of operations by using each DRAM column as an independent SIMD lane to perform bit-serial operations. SIMDRAM consists of three key steps to enable a desired operation in DRAM: (1) building an efficient majority-based representation of the desired operation, (2) mapping the operation input and output operands to DRAM rows and to the required DRAM commands that produce the desired operation, and (3) executing the operation. These three steps ensure efficient computation of any arbitrary and complex operation in DRAM. The first two steps give users the flexibility to efficiently implement and compute any desired operation in DRAM. The third step controls the execution flow of the in-DRAM computation, transparently from the user. We comprehensively evaluate SIMDRAM's reliability, area ove

The demand for precise information on DRAM microarchitectures and error characteristics has surged, driven by the need to explore processing in memory, enhance reliability, and mitigate security vulnerability. Nonetheless, DRAM manufacturers have disclosed only a limited amount of information, making it difficult to find specific information on their DRAM microarchitectures. This paper addresses this gap by presenting more rigorous findings on the microarchitectures of commodity DRAM chips and their impacts on the characteristics of activate-induced bitflips (AIBs), such as RowHammer and RowPress. The previous studies have also attempted to understand the DRAM microarchitectures and associated behaviors, but we have found some of their results to be misled by inaccurate address mapping and internal data swizzling, or lack of a deeper understanding of the modern DRAM cell structure. For accurate and efficient reverse-engineering, we use three tools: AIBs, retention time test, and RowCopy, which can be cross-validated. With these three tools, we first take a macroscopic view of modern DRAM chips to uncover the size, structure, and operation of their subarrays, memory array tiles (MAT

The energy consumption of DRAM is a critical concern in modern computing systems. Improvements in manufacturing process technology have allowed DRAM vendors to lower the DRAM supply voltage conservatively, which reduces some of the DRAM energy consumption. We would like to reduce the DRAM supply voltage more aggressively, to further reduce energy. Aggressive supply voltage reduction requires a thorough understanding of the effect voltage scaling has on DRAM access latency and DRAM reliability. In this paper, we take a comprehensive approach to understanding and exploiting the latency and reliability characteristics of modern DRAM when the supply voltage is lowered below the nominal voltage level specified by DRAM standards. Using an FPGA-based testing platform, we perform an experimental study of 124 real DDR3L (low-voltage) DRAM chips manufactured recently by three major DRAM vendors. We find that reducing the supply voltage below a certain point introduces bit errors in the data, and we comprehensively characterize the behavior of these errors. We discover that these errors can be avoided by increasing the latency of three major DRAM operations (activation, restoration, and prech